In 2030, the India metal bonding adhesives market is projected to generate $343.6 million revenue, due to increase requirement of metal bonding adhesives led by industrial applications, including base plates, reaction injection, cooling water pumps, ultracentrifuge rotors, industrial pumps, and reaction injection molding machines.
The shift of consumers from traditional fasteners to metal bonding adhesives is witnessed in the India metal bonding adhesives market, owing to their numerous advantages such as lightweight, low cost, eco-friendliness, fuel economy, and improved aesthetics of the final product. Moreover, the higher industrial application of the metal bonding adhesives in aircraft and automobile manufacturing than rivets or other mechanical fasteners is led by the easy usage and ability to equally distribute loads. In addition, the emergence of electric vehicles and rising focus to decrease vehicular weight and expand economy are predicted to increase the demand for metal bonding adhesives in India.
In addition, the expansion of the manufacturing sector is a key driver of the India metal bonding adhesives market in the country. Numerous government initiatives fuel the expansion of the manufacturing sector, such as Make in India, resulting in new players entering the industry leading to increased adoption of advanced machinery. It further contributes to the increase requirement for adhesives to cater to the requirement of the joining metal substrates. In addition, the numerous advantages of these adhesives have increased their industrial consumption in the last few years.
The players in the India metal bonding adhesives market are offered huge opportunities by the healthcare sector, led by the massive demand for healthcare equipment. The production of healthcare equipment such as surgical equipment, biosensors, X-ray machines, and implantable devices requires massive usage of metal bonding adhesives. That is why the predicted surge in healthcare equipment is projected to result in the market proliferation.
